"Unique digital-centric architecture provides our interconnect IPs with superior PPA and portability - offering exceptional system options to our customers."
Dr. Mondrian Nuessle
CTO & Co-Founder
EXCELLENT ULTRA-LOW
POWER TECHNOLOGY
AI will drastically increase the energy consumption of the internet, both in data centers and at the edge. Data traffic, especially of high-speed interconnects, is a major contributor. EXTOLL with its products is contributing to achieve sustainability by providing leading-edge ultra-low power solutions.
CHIPLETS
Chiplets are the future of semiconductors and represent a new era of heterogeneous system integration. They offer a number of advantages, including scalability, flexibility, energy- and cost-effectiveness. EXTOLL is at the forefront of the chiplet revolution, providing customers with the solutions they need to design and develop next-generation chiplet-based systems.
Ultra-Low Power High-Speed SerDes
Our SerDes technology enables unmatched data transfer speeds up to 32Gbps.
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UCIe for Chiplets
We offer state-of-the-art Universal Chiplet Interconnect Express (UCIe) solutions.
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NOC-X for
C2C/D2D Connectivity
Our Network-on-Chip solutions provide seamless interconnectivity across chiplets and dies.
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SYSTEM THINKING
EXTOLL's commitment to innovation extends to our cutting-edge system simulation capabilities. Our 2D Mesh Technology is not confined by chiplet boundaries, making it ideal for chip-to-chip links with exceptional transparency and reliability. With support for various protocols, including cache-coherency (CHI, AXI, etc.), our solutions are configurable to meet your specific requirements. Furthermore, our technology has been proven in RISC-V based chip architectures.
SUSTAINABILITY
Power Saving
High-speed data traffic has a fair share of the overall energy consumption of the internet and its connected edge devices.
EXTOLL´s products are super energy efficient and are helping to reduce the internet´s raise of overall power consumption in the nearby future.
Chip Area
Our SerDes IP has an extremely small footprint. This leads to lower chip area of ASICs, SOCs and Chiplets which is beneficial for customers. Moreover, having smaller chips also means less energy and material usage in production.