"Unique digital-centric architecture provides our interconnect IPs with superior PPA and portability - offering exceptional system options to our customers."
Dr. Mondrian Nuessle
CTO & Co-Founder
EXCELLENT ULTRA-LOW
POWER TECHNOLOGY
AI will drastically increase the energy consumption of the internet, both in data centers and at the edge. Data traffic, especially of high-speed interconnects, is a major contributor. EXTOLL with its products is contributing to achieve sustainability by providing leading-edge ultra-low power solutions.
CHIPLETS
Chiplets are the future of semiconductors and represent a new era of heterogeneous system integration. They offer a number of advantages, including scalability, flexibility, energy- and cost-effectiveness. EXTOLL is at the forefront of the chiplet revolution, providing customers with the solutions they need to design and develop next-generation chiplet-based systems.
Ultra-Low Power High-Speed SerDes
Our SerDes technology enables unmatched data transfer speeds up to 32Gbps.
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UCIe for Chiplets
We offer state-of-the-art Universal Chiplet Interconnect Express (UCIe) solutions.
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NOC-X for
C2C/D2D Connectivity
Our Network-on-Chip solutions provide seamless interconnectivity across chiplets and dies.
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SYSTEM THINKING
EXTOLL's commitment to innovation extends to our cutting-edge system simulation capabilities. Our 2D Mesh Technology is not confined by chiplet boundaries, making it ideal for chip-to-chip links with exceptional transparency and reliability. With support for various protocols, including cache-coherency (CHI, AXI, etc.), our solutions are configurable to meet your specific requirements. Furthermore, our technology has been proven in RISC-V based chip architectures.
