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UCIe Chiplet Extoll with Chip Interfaces

EXTOLL and Chip Interfaces unveil the Industry´s first UCIe IP Solution for GlobalFoundries FDX Technology

Press Release Mannheim, Germany, May 28, 2026 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, and Chip Interfaces, a leading supplier of digital IP cores are proud to introduce the industry´s first integrated UCIe IP solution (PHY and D2D Adapter) for GlobalFoundries’ (GF) FDX™ technology. The customer-ready offering is based on EXTOLL´s PHY and Chip Interfaces´ D2D Adapter, which comes as a pre-integrated and co-verified plat

irenamarasek

4 days ago3 min read

EXTOLL and Chip Interfaces introduce the Industry´s first Integrated UCIe IP Solution for GlobalFoundries FDX Technology

Press Release Mannheim, Germany, May 21, 2026 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, and Chip Interfaces, a leading supplier of digital IP cores are thrilled to offer the industry´s first integrated UCIe IP solution (PHY and D2D Adapter) for GlobalFoundries’ (GF) FDX™ technology. The offering is customer-ready and integrates EXTOLL´s PHY and Chip Interfaces´ D2D Adapter as a co-verified platform to realize highly effi

irenamarasek6

May 222 min read

EXTOLL announces Availability of Industry´s first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration

Press Release Mannheim, Germany, May 12, 2026 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, announces the availability and readiness for customer integration of the industry´s first 16G UCIe PHY IP in GlobalFoundries´ 22FDX/22FDX+ technology. The IP marks a significant milestone in chiplet interconnectivity for mainstream foundry nodes. It is optimized for standard packaging, with full support for organic substrates across s

irenamarasek

May 122 min read