UNLEASH THE CHIPLET AGE
"EXTOLL´s lowest-power interconnect technology empowers the next generation of chip connectivity needed for chiplet-based solutions and helps to significantly reduce the raising energy consumption of modern systems, such as Edge-AI and -Computing, 5G/6G/Satellite Communications, and IoT."
ABOUT US
Dirk Wieberneit
CEO
X-STORY
The Beginning of EXTOLL
In 2008, a team of scientists at the University of Heidelberg began working on new technologies for high-performance interconnects. The goal of the team was to develop interconnects that offer higher performance and efficiency than existing solutions. The team worked on a variety of technologies, including optical interconnects, chip-to-chip interconnects, and network-on-chip interconnects. The team also developed new methods for designing and simulating interconnects. In 2011, the team of scientists founded the company EXTOLL to commercialize their technologies.
High-Performance Computing Success
EXTOLL initially focused on the high-performance computing (HPC) market. This market has the highest demand for high-performance interconnects, as HPC systems require the ability to quickly and efficiently communicate with each other. Our products were very successful from the start. The company quickly gained customers from the HPC industry. EXTOLL 's success in the HPC market is due to a number of factors, including the company's innovative technologies, its strong partnerships with leading chipmakers, and its focus on customer satisfaction.
Diversification and Expansion
In 2015, we began offering our products to other markets. These markets include communication, space, industrial, and automotive. EXTOLL's products have been well-received in these new markets. The company has been able to achieve rapid success in these markets, thanks to its strong technical capabilities and its commitment to customer service.
Leading the Field
Today, EXTOLL is a leading provider of high-performance interconnect IP. The company offers a broad range of products and solutions that meet the needs of today's applications. We are committed to innovation and continue to develop new technologies for high-performance interconnects. The company is well-positioned to continue its growth in the future.
MEET THE LEADERSHIP TEAM
CEO
Dirk Wieberneit
Dirk has spent more than 30 years in the consumer and communication semiconductor space, serving in different R&D, CTO, and General Management positions at Intel, Lantiq, Trident Microsystems, Micronas, and Infineon Technologies. He joined EXTOLL in 2021 as CEO to strengthen the leadership team with his strong background and management experience in a fabless semiconductor business.
CTO & Co-Founder
Dr. Mondrian Nuessle
Mondrian spent more than 10 years as a researcher in Computer Architecture at the University of Mannheim and Heidelberg University, focusing on interconnection network systems for High-Performance Computing. He is one of the Co-Founders of EXTOLL. As CTO from the very beginning, Mondrian was part of developing EXTOLL leading technology, growing the team from employee number one to an international team from 12 different countries.
CFO / COO & Co-Founder
Dr. Ulrich Krackhardt
Uli is a physicist and as a co-founder and COO / CFO of EXTOLL he brings in broad experience ranging from micro-optics including setting up and running a clean-room fabrication lab over various industry engagements like as GM of a premium car dealer group of 220+ staff size and having won multiple awards. As a serial entrepreneur, he founded a consulting and software company for car manufacturers, and a company for optical quality control for mass-production of automotive head-up displays.
PARTNERSHIPS & COLLABORATIONS
We deliver innovative products serving highest customer demands on latest Foundry technology. With partnerships we excel by enabling pre-integrated solutions for highest performance and interoperability on ASICs.
GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented global team delivers results with an unyielding focus on security, longevity, and sustainability. For more information, visit www.gf.com
Chip Interfaces is a leading provider of high-performance digital IP cores, designed to meet the rigorous demands of next-generation applications. The extensive interface IP portfolio includes JESD204, MIPI, Interlaken, CPRI/eCPRI, UCIe Die to Die Adapter, and RSFECs, all of which are silicon-agnostic and customizable. Chip Interfaces commitment to quality and excellence, combined with a genuine desire to see customers succeed, makes Chip Interfaces a trusted partner for every project. Collaboration between Chip Interfaces controllers and PHYs from Extoll, a leading supplier of high-speed and ultra-low power SerDes and Chiplet connectivity, will bring to our customers interoperability tested, reliable and easy to use solutions for JESD204 and UCIe among others. For more information, visit www.chipinterfaces.com