UNLEASH THE CHIPLET AGE
"EXTOLL´s lowest-power interconnect technology empowers the next generation of chip connectivity needed for chiplet-based solutions and helps to significantly reduce the raising energy consumption of modern systems, such as Edge-AI and -Computing, 5G/6G/Satellite Communications, and IoT."
ABOUT US
Dirk Wieberneit
CEO
X-STORY
The Beginning of EXTOLL
In 2008, a team of scientists at the University of Heidelberg began working on new technologies for high-performance interconnects. The goal of the team was to develop interconnects that offer higher performance and efficiency than existing solutions. The team worked on a variety of technologies, including optical interconnects, chip-to-chip interconnects, and network-on-chip interconnects. The team also developed new methods for designing and simulating interconnects. In 2011, the team of scientists founded the company EXTOLL to commercialize their technologies.
High-Performance Computing Success
EXTOLL initially focused on the high-performance computing (HPC) market. This market has the highest demand for high-performance interconnects, as HPC systems require the ability to quickly and efficiently communicate with each other. Our products were very successful from the start. The company quickly gained customers from the HPC industry. EXTOLL 's success in the HPC market is due to a number of factors, including the company's innovative technologies, its strong partnerships with leading chipmakers, and its focus on customer satisfaction.
Diversification and Expansion
In 2015, we began offering our products to other markets. These markets include communication, space, industrial, and automotive. EXTOLL's products have been well-received in these new markets. The company has been able to achieve rapid success in these markets, thanks to its strong technical capabilities and its commitment to customer service.
Leading the Field
Today, EXTOLL is a leading provider of high-performance interconnect IP. The company offers a broad range of products and solutions that meet the needs of today's applications. We are committed to innovation and continue to develop new technologies for high-performance interconnects. The company is well-positioned to continue its growth in the future.
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