X-NEWS

We are very excited to participate in the upcoming Technology GTS Summit 2024 as a Gold Partner of GlobalFoundries. EXTOLL will be present with an Exhibitor table at all 3 annual signature events, which brings GlobalFoundries’ customers and partners together to share insights and gain new perspectives on the industry that’s changing the world.   Aug 29, 2024: Santa Clara, USA https://gf.swoogo.com/gftechsummit2024-na Sep 18, 2024: Munich, Germany https://gf.swoogo.com/gtsemea24 Oct 16, 2024: Shanghai, China https://gf.com/newsroom/events/   We are very much looking forward to meeting you there – please reach out to sales@extoll.com  to make an appointment at one of the show floors.

Copenhagen, Denmark, September 13, 2024: " We are thrilled to have successfully completed the interoperability test with Extoll's Ultra-Low Power PHY ," said  Thomas Nørgaard, CEO at Comcores. " This accomplishment not only validates the quality and reliability of our JESD204C IP core but also highlights our commitment to delivering cutting-edge solutions as a trusted partner of our defense customers. " " We are excited to collaborate with Comcores on customer projects and deliver our combined technologies to the market. The successful interoperability of our combined solution demonstrates the strength of our partnership and commitment to meeting customer requirements  " (Dirk Wieberneit, CEO at Extoll) Both companies collaborate with BAE Systems on the technology for a new chiplet ecosystem ( BAE Systems to deliver advanced microelectronics to U.S. defense industrial base ). The JESD204C controller IP from Comcores is a highly optimized and silicon-agnostic implementation of the JEDEC JESD204C.1 serial interface standard. The IP core supports line speeds up to 32.5 Gbps per lane with 64b/66b encoding and includes full backwards compatibility with JESD204B and its 8b/10b encoding. The IP comes with the widest parameter set available and has gone through extensive testing. For inquiries about the JESD204C IP, write to sales@comcores.com or visit the website at www.comcores.com  for more. About Comcores Comcores is a leading supplier of digital IP Cores and solutions for Ethernet-based solutions, wireless systems, and Chip to Chip Interfaces. Comcores’ mission is to provide best-in-class, state-of-the-art, quality components and solutions to ASIC, FPGA, and System vendors and drastically reduce their product cost, risk, and time to market. Our long-term background in building digital IPs for ASIC projects and our deep understanding of Ethernet-based networks and digital radio systems make Comcores the ideal part for projects that require state-of-the-art and high-quality solutions. To know more about the products and solutions please visit us www.comcores.com About Extoll EXTOLL, a leading supplier of high-speed and ultra-low power SerDes and Chiplet connectivity, designs and develops semiconductor IP with the smallest footprints and highest PPA in the industry, serving the worldwide market of ASIC, SoC and Chiplet-Makers in various segments. The portfolio provides customers with tailored solutions for their systems covering NoC (Network-on-Chip) and Die-to-Die interfaces. EXTOLL delivers innovative solutions to enable customers to successfully migrate into the Chiplet Age. Find out more about the products and solutions – please visit us at  www.extoll.com

EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BAE Systems as a key partner for the STEAM PIPE project to provide a power-optimized very short-reach SerDes IP solution. EXTOLL is supplying BAE Systems with the technology to develop and deliver advanced microelectronics for the U.S. Defense Industrial Base as part of their Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE) project – Click for more: BAE Systems to deliver advanced microelectronics to U.S. defense industrial base | BAE Systems “This collaboration emphasizes EXTOLL´s strength in ultra-low power design, particularly in the 12nm process geometry. We are happy and honored to jointly work with BAE Systems, a renowned industry leader on critical solutions for the highly demanding aerospace and defense segments.”, says Dirk Wieberneit, CEO of EXTOLL. EXTOLL´s IP is optimized to deliver highest speeds at smallest footprint and lowest power consumption, enabling a super energy-efficient solution for chiplet-based systems. The SerDes IP core supports line speeds up to 32 Gbps per lane and comes with generic support of various protocols and availability in 12 - 22nm process nodes.   Please address your inquiries to  sales@extoll.com     and visit our website at   www.extoll.com .   About EXTOLL EXTOLL, a leading supplier of high-speed and ultra-low power SerDes and Chiplet connectivity, designs and develops semiconductor IP with the smallest footprints and highest PPA in the industry, serving the worldwide market of ASIC, SoC- and Chiplet-Makers in various segments. The portfolio provides customers with tailored solutions for their systems covering NoC (Network-on-Chip) and Die-to-Die interfaces.EXTOLL delivers innovative solutions to enable customers to successfully migrate into the Chiplet Age. Find out more about our products and solutions – please visit us at  www.extoll.com

Mannheim, Germany, September, 2024—EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by PsiQuantum as a key SerDes IP block supplier for its digital ASIC development. “This collaboration emphasizes EXTOLL´s strength in ultra-low power design, particularly in the GF22FDX process geometry. We are happy and honored to jointly work with PsiQuantum a renowned industry leader on Quantum computing”, says Dirk Wieberneit, CEO of EXTOLL. EXTOLL´s IP is optimized to deliver highest speeds at smallest footprint and lowest power consumption, enabling a super energy-efficient solution for chiplet-based systems. The SerDes IP core supports line speeds up to 32 Gbps per lane and comes with generic support of various protocols and availability in GF12 - GF22nm process nodes. Please address your inquiries to  sales@extoll.com   and visit our website at  www.extoll.com

As a technology provider and proud member of the EPI consortium, EXTOLL would like to inform about the upcoming EPI Forum on 9 and 10 October 2024 in Barcelona, Spain. https://www.european-processor-initiative.eu/epi-forum-2024/ EPI Forum will gather experts from the HPC ecosystem, stakeholders in the field and EPI researchers and engineers to discuss and present EPI’s achievement so far and future developments in the Initiative. Registration for the event is now open.

We are glad to share that we have started operations in Villach, Austria. First employees have started their work already, more colleagues are expected to join shortly. The Design Center in Villach will be the third location of EXTOLL besides the Headquarter in Mannheim, Germany and our Design Center in Thessaloniki, Greece.   EXTOLL continues expanding its team with highly skilled Analog and Digital Chip-Design & -Layout experts to pursue its exciting product & technology roadmap. The Design Center Villach is the next milestone on EXTOLL’s growth path.