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  • EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC

    Press Release Mannheim, Germany, January 30, 2025 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.   “This collaboration emphasizes EXTOLL´s strength in ultra-low power design, particularly on GF’s 22FDX process geometry enabling future communication innovations. We are happy and honored to jointly work with BeammWave on creating solutions for breakthrough digital beamforming technology,” says Dirk Wieberneit, CEO of EXTOLL.   EXTOLL´s IP is optimized to deliver highest speeds at smallest footprint and lowest power consumption, enabling a super energy-efficient solution for chiplet-based systems and providing a unique solution for the rising demand on multiple lanes connections. The complete SerDes IP core supports line speeds up to 32 Gbps per lane and comes with generic support of various protocols and available on GF’s 22FDX, 12LP and 12LP+ platforms.   GF’s 22FDX process technology offers superior RF/Mixed-Signal performance, power efficiency, SoC integration and radiation-hardened reliability for technologies in the communications infrastructure and SATCOM markets. 22FDX is the only fully depleted SOI solution that combines high-performance RF capabilities with high-speed, high-density digital logic, ensuring efficient and reliable connectivity for various applications like beamforming, which demand both power efficiency and high-speed connectivity.   “We are thrilled to partner with EXTOLL on their industry leading Very Short Reach SerDes technology in 22nm,“ said Per-Olof Brandt, Chief Technology Officer at BeammWave. “Extoll is continuing to innovate on this important process node for us, enabling a unique solution for best-in-class power and performance that our customers need. This makes them a perfect fit for BeammWave´s ambitious mmWave products for 5G and 6G.”   “As we see an increasing market demand for our 22FDX process technology in various beamforming applications, we are delighted to see our IP partner EXTOLL continuing to innovate on this node, enabling next-generation chiplet solutions based on their ultra-low power interconnect technologies,” said Ziv Hammer, Senior Vice President of Design Platforms and Services at GlobalFoundries. “GF remains fully committed to working with our partners and customers to deliver solutions for essential technologies that support global connectivity.”   Please address your inquiries to  sales@extoll.com     and visit our website at   www.extoll.com .   About EXTOLL EXTOLL, a leading supplier of high-speed and ultra-low power SerDes and Chiplet connectivity, designs and develops semiconductor IP with the smallest footprints and highest PPA in the industry, serving the worldwide market of ASIC, SoC- and Chiplet-Makers in various segments. The portfolio provides customers with tailored solutions for their systems covering NoC (Network-on-Chip) and Die-to-Die interfaces.EXTOLL delivers innovative solutions to enable customers to successfully migrate into the Chiplet Age. Find out more about our products and solutions – please visit us at  www.extoll.com   About BeammWave BeammWave AB are experts in communication solutions for frequencies over 24GHz. The company is building a solution intended for 5G and 6G, in the form of a radio chip with antenna and associated algorithms. The company's approach with digital beamforming is unique and patented, with the aim of delivering a solution with higher performance at a lower cost. The company's Class B shares (BEAMMW B) are listed on the Nasdaq First North Growth Market in Stockholm.   About GlobalFoundries GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented and diverse team delivers results with an unyielding focus on security, longevity, and sustainability. For more information, visit   www.gf.com .

  • Comcores and Extoll successfully completed the interoperability test of Comcores JESD204C IP core and Extoll SerDes PHY

    Copenhagen, Denmark, September 13, 2024: " We are thrilled to have successfully completed the interoperability test with Extoll's Ultra-Low Power PHY ," said  Thomas Nørgaard, CEO at Comcores. " This accomplishment not only validates the quality and reliability of our JESD204C IP core but also highlights our commitment to delivering cutting-edge solutions as a trusted partner of our defense customers. " " We are excited to collaborate with Comcores on customer projects and deliver our combined technologies to the market. The successful interoperability of our combined solution demonstrates the strength of our partnership and commitment to meeting customer requirements  " (Dirk Wieberneit, CEO at Extoll) Both companies collaborate with BAE Systems on the technology for a new chiplet ecosystem ( BAE Systems to deliver advanced microelectronics to U.S. defense industrial base ). The JESD204C controller IP from Comcores is a highly optimized and silicon-agnostic implementation of the JEDEC JESD204C.1 serial interface standard. The IP core supports line speeds up to 32.5 Gbps per lane with 64b/66b encoding and includes full backwards compatibility with JESD204B and its 8b/10b encoding. The IP comes with the widest parameter set available and has gone through extensive testing. For inquiries about the JESD204C IP, write to sales@comcores.com or visit the website at www.comcores.com  for more. About Comcores Comcores is a leading supplier of digital IP Cores and solutions for Ethernet-based solutions, wireless systems, and Chip to Chip Interfaces. Comcores’ mission is to provide best-in-class, state-of-the-art, quality components and solutions to ASIC, FPGA, and System vendors and drastically reduce their product cost, risk, and time to market. Our long-term background in building digital IPs for ASIC projects and our deep understanding of Ethernet-based networks and digital radio systems make Comcores the ideal part for projects that require state-of-the-art and high-quality solutions. To know more about the products and solutions please visit us www.comcores.com About Extoll EXTOLL, a leading supplier of high-speed and ultra-low power SerDes and Chiplet connectivity, designs and develops semiconductor IP with the smallest footprints and highest PPA in the industry, serving the worldwide market of ASIC, SoC and Chiplet-Makers in various segments. The portfolio provides customers with tailored solutions for their systems covering NoC (Network-on-Chip) and Die-to-Die interfaces. EXTOLL delivers innovative solutions to enable customers to successfully migrate into the Chiplet Age. Find out more about the products and solutions – please visit us at  www.extoll.com

  • EXTOLL collaborates with BAE Systems as a Key Partner for High-Speed SerDes IP

    EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BAE Systems as a key partner for the STEAM PIPE project to provide a power-optimized very short-reach SerDes IP solution. EXTOLL is supplying BAE Systems with the technology to develop and deliver advanced microelectronics for the U.S. Defense Industrial Base as part of their Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE) project – Click for more: BAE Systems to deliver advanced microelectronics to U.S. defense industrial base | BAE Systems “This collaboration emphasizes EXTOLL´s strength in ultra-low power design, particularly in the 12nm process geometry. We are happy and honored to jointly work with BAE Systems, a renowned industry leader on critical solutions for the highly demanding aerospace and defense segments.”, says Dirk Wieberneit, CEO of EXTOLL. EXTOLL´s IP is optimized to deliver highest speeds at smallest footprint and lowest power consumption, enabling a super energy-efficient solution for chiplet-based systems. The SerDes IP core supports line speeds up to 32 Gbps per lane and comes with generic support of various protocols and availability in 12 - 22nm process nodes.   Please address your inquiries to  sales@extoll.com     and visit our website at   www.extoll.com .   About EXTOLL EXTOLL, a leading supplier of high-speed and ultra-low power SerDes and Chiplet connectivity, designs and develops semiconductor IP with the smallest footprints and highest PPA in the industry, serving the worldwide market of ASIC, SoC- and Chiplet-Makers in various segments. The portfolio provides customers with tailored solutions for their systems covering NoC (Network-on-Chip) and Die-to-Die interfaces.EXTOLL delivers innovative solutions to enable customers to successfully migrate into the Chiplet Age. Find out more about our products and solutions – please visit us at  www.extoll.com

  • EXTOLL collaborates with PsiQuantum as a Key Partner for High-Speed SerDes IP

    Mannheim, Germany, September, 2024—EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by PsiQuantum as a key SerDes IP block supplier for its digital ASIC development. “This collaboration emphasizes EXTOLL´s strength in ultra-low power design, particularly in the GF22FDX process geometry. We are happy and honored to jointly work with PsiQuantum a renowned industry leader on Quantum computing”, says Dirk Wieberneit, CEO of EXTOLL. EXTOLL´s IP is optimized to deliver highest speeds at smallest footprint and lowest power consumption, enabling a super energy-efficient solution for chiplet-based systems. The SerDes IP core supports line speeds up to 32 Gbps per lane and comes with generic support of various protocols and availability in GF12 - GF22nm process nodes. Please address your inquiries to  sales@extoll.com   and visit our website at  www.extoll.com

  • EXTOLL to start Design Center in Villach, Austria

    We are glad to share that we have started operations in Villach, Austria. First employees have started their work already, more colleagues are expected to join shortly. The Design Center in Villach will be the third location of EXTOLL besides the Headquarter in Mannheim, Germany and our Design Center in Thessaloniki, Greece.   EXTOLL continues expanding its team with highly skilled Analog and Digital Chip-Design & -Layout experts to pursue its exciting product & technology roadmap. The Design Center Villach is the next milestone on EXTOLL’s growth path.

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